Heat spreader for cooling electronic components
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United States of America Patent
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Issued Date -
Dec 14, 2006
app pub date -
Jun 8, 2005
filing date -
Jun 8, 2005
priority date (Note) -
Abandoned
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Abstract
A unitary heat spreader for cooling electronic components comprising an evaporator section comprising a plate configured for heat exchange communication with electronic components and a plurality of elongated evaporator channels therein, and a liquid phase-change refrigerant in the evaporator channels, and first and second condenser sections configured to substantially avoid heat exchange contact with electronic components, each condenser section comprising one or more elongated condenser channels in open and continuous fluid communication with one or more of the evaporator channels.
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