Image sensor chip package and method of manufacturing the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Dec 7, 2006
app pub date -
Apr 4, 2006
filing date -
Jun 3, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An image sensor chip package (200) includes a base (20), an image sensor chip (23), a plurality of wires (24), an adhesive means (26) and a cover (28). The base has a top surface (201) and a plurality of top pads (204) arranged on the top surface. The image sensor chip is mounted on the top surface of the base and includes a photosensitive area (231) and a plurality of chip pads (232) around the photosensitive area. The wires electrically connect the chip pads of image sensor chip and the top pads of the base. The adhesive means is applied on peripheral edge of the image sensor chip, over the wires and covers areas where the wires connecting with the chip pads. The cover is transparent and is mounted to the image sensor chip via the adhesive means. The cover seals the photosensitive area of the image sensor chip.
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