Interconnecting apparatus and a contact element therefor
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Nov 30, 2006
app pub date -
Feb 19, 2003
filing date -
Feb 19, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An interconnecting apparatus (10) is disclosed for use in testing electronic devices. The apparatus (10) includes a housing portion (12, 14) provided with a plurality of apertures extending between oppositely facing first and second surfaces of the housing portion (12, 14) and a plurality of contact elements (16), each contact element (16) being disposed in an aperture. Each contact element (16) is a helical spring formed of electrically conductive material, a first end portion of each spring being located adjacent the first surface of the housing portion (12, 14) and a second opposite end portion of each spring being located adjacent the second surface of the housing portion (12, 14). Each spring is configured so that the diameter of the spring decreases in a direction away from the first end portion. The arrangement is such that during use the first end portion receives and makes electrical connection with a device contact of an electronic device under test and the second end portion makes electrical connection with a test contact of a test board.
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