Apparatus and method using stackable substrates
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United States of America Patent
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Issued Date -
Nov 30, 2006
app pub date -
Feb 6, 2006
filing date -
Feb 9, 2005
priority date (Note) -
Abandoned
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Abstract
An embodiment of the present invention provides an apparatus, comprising a plurality of stacked substrates, wherein the substrates are capable of accepting surface mounted components (SMCs) and wherein the plurality of stacked substrates are separated and connected by the surface mounted components (SMC) or solder balls or both.
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