Solder alloy and a semiconductor device using the solder alloy
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United States of America Patent
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Issued Date -
Nov 23, 2006
app pub date -
Feb 2, 2006
filing date -
May 20, 2005
priority date (Note) -
Abandoned
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Abstract
A solder alloy contains from 3 to 5 wt % of antimony (Sb), not more than 0.2 wt % of germanium (Ge), and the balance of tin (Sn). In a semiconductor device, the solder alloy can be used to join a semiconductor chip and a conductor pattern on the front surface of an insulative substrate, a conductor pattern on the back surface of the insulative substrate and a heat sink plate, and the semiconductor chip and a wiring conductor. The solder alloy exhibits excellent wettability and satisfactory bonding performance.
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