Atomic layer deposition of high-k metal oxides

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United States of America Patent

APP PUB NO 20060258078A1
SERIAL NO

10524814

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Abstract

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The present invention relates to the atomic layer deposition ('ALD') of high k dielectric layers of metal oxides containing Group 4 metals, including hafnium oxide, zirconium oxide, and titanium oxide. More particularly, the present invention relates to the ALD formation of Group 4 metal oxide films using an metal alkyl amide as a metal organic precursor and ozone as a co-reactant.

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AVIZA TECHNOLOGY INC440 KINGS VILLAGE ROAD SCOTTS VALLEY CA 95066
INTEGRATED PROCESS SYSTEMS LTD33 JIJE-DONG PYUNGTAK-SI KYUNGKI-DO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Sang-In Cupertino, CA 87 8080
Lee, Sang-Kyoo Seoul, KR 4 1054
Senzaki, Yoshihide Austin, TX 40 5077

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  • 505 Citation Count
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  • 96.53 % this patent is cited more than
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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges651199722376222132986546322210701 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +01002003004005006007008009001000110012001300

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