Mold-casting structure and improvement method for grounding of the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20060254042A1
SERIAL NO

11194542

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A mold-casting structure comprises at least one dishing and a plurality of micro-protrusions. The dishing(s) formed on the surface of a mold-casting body, the plurality of micro-protrusions sticking out of the surface of the dishing, and the tops of the micro-protrusions constitute on a plane, so that the grounding issue of the circuitry embedded in the mold-casting structure caused by the dishing can be resolved. The dishing can be verified by daubing paint and scrapping thereafter, the location of remaining paint is deemed the dishing. Moreover, a three-dimensional measurement instrument can be employed for more precise measurement. The micro-protrusions can be formed on the dishing by mechanical processing or electric discharge machining (EDM). Alternatively, a mold with a structure matching the micro-protrusions can be formed first, and consequently the micro-protrusions are formed directly by mold-filling, which is more suitable for mass production.

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Patent Owner(s)

Patent OwnerAddress
MICROELECTRONICS TECHNOLOGY INCNO 1 INNOVATION ROAD II HSINCHU SCIENCE-BASED INDUSTRIAL PARK HSINCHU 300

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chou, Wen Pin Hsinchu, TW 5 52
Yang, Lan Chun Miaoli, TW 1 44

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