Au alloy bonding wire
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United States of America Patent
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N/A
Issued Date -
Nov 9, 2006
app pub date -
May 5, 2006
filing date -
May 9, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Provided is a gold alloy bonding wire for semiconductor packaging. The gold alloy bonding wire is formed of gold having an ultrahigh purity of 99.999% or more. The gold alloy includes at least one of Mo, As, Po, and B within a range between 2 wt ppm and 25 wt ppm. The gold alloy may further include at least one of Na, Cd, Sb, Ta, and Cs within a range between 2 wt ppm and 30 wt ppm. The gold alloy may further include at least one of P, Tc, Re, Tl, and Ho within a range between 3 wt ppm and 30 wt ppm. The gold alloy may further include at least one of Na, Cd, Sb, Ta, and Cs within a range between 2 wt ppm and 30 wt ppm and at least one of P, Tc, Re, Tl, and Ho within a range between 3 wt ppm and 30 wt ppm.
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