Circuit board and process for producing the same
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United States of America Patent
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Issued Date -
Nov 9, 2006
app pub date -
Jun 30, 2004
filing date -
Jul 10, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
In the case of using a photosensitive insulating resin for a surface protective layer of a circuit wiring pattern, or for an insulating layer between circuit wiring conductor layers in a circuit board, Na ions adsorbed on the photosensitive insulating resin are replaced with a polyvalent metal through a treatment step containing Na ions which is executed after a heat curing step of the photosensitive insulating resin. For the polyvalent metal, a II group including Mg or Ca can be selected.
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