Method of manufacturing a heat transfer element for in vivo cooling
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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N/A
Issued Date -
N/A
app pub date -
Jun 27, 2006
filing date -
Jan 23, 1998
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An intravascular heat transfer device is provided with a mixing-inducing surface formed by an easily manufacturable process. The device can have a plurality of elongated, articulated segments, each having a mixing-inducing exterior surface. A flexible joint connects adjacent elongated, articulated segments. The device may be conveniently formed, e.g., by vapor deposition or molding, and further lacks undercuts so that the same may be conveniently removed from, e.g., a two-part mold.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
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PHILIPS ELECTRONICS NORTH AMERICA CORPORATION | 100 EAST 42ND STREET NEW YORK NY 10017 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
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Nest, Mark Van | Spring Valley, CA | 3 | 34 |
# of filed Patents : 3 Total Citations : 34 | |||
Yon, Steven A | San Diego, CA | 24 | 1639 |
# of filed Patents : 24 Total Citations : 1639 |
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Patent Citation Ranking
- 13 Citation Count
- A61F Class
- 22.73 % this patent is cited more than
- 19 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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