Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directions
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United States of America Patent
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app pub date -
Jun 23, 2006
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Jan 26, 2000
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Abstract
A material for a semiconductor-mounting heat dissipation substrate comprises a copper-molybdenum rolled composite obtained by impregnating melted copper into a void between powder particles of a molybdenum powder compact to obtain a molybdenum-copper composite and then rolling the composite. In a final rolling direction of a plate material, the coefficient of linear expansion is 8.3.times.10.sup.-6/K at 30-800.degree. C. The material for a semiconductor-mounting heat dissipation substrate is superior in thermal conductivity to a CMC clad material and easy in machining by a punch press. The substrate material is used as a heat dissipation substrate (13) of a ceramic package (11).
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