Device for accommodating disk-shaped objects and apparatus for handling objects
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United States of America Patent
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app pub date -
Jan 17, 2006
filing date -
May 18, 2001
priority date (Note) -
Abandoned
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Abstract
A device is provided for accommodating disk-shaped objects, preferably semiconductor wafers for a thermal treatment thereof. The device has a carrier with at least two recesses for respective objects, and at least one cover for covering at least one of the recesses. A handling apparatus is also provided and has at least one transport arm, at least one support arm, at least one support drive provided on the arm for supporting, via vacuum, at least one object that is to be handled, a device for determining the individual weight of an object, and a vacuum control device for altering the vacuum as a function of the individual weight of an object.
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