Polyoxyalkylene amine-modified polyamideimide resin and composition thereof
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United States of America Patent
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Issued Date -
Oct 26, 2006
app pub date -
Mar 9, 2006
filing date -
Mar 16, 2005
priority date (Note) -
Abandoned
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Abstract
The present invention provides a polyoxyalkylene amine-modified polyamideimide resin and a polyamideimide resin composition includes said polyoxyalkylene amine-modified polyamideimide resin, a thermosetting resin and a rubber elastomer, and may further include an inorganic filler. The polyamideimide resin composition of the present invention has high heat resistance and high bond strength and can achieve sufficient adhesion at lower temperature, for example, 160 to 180.degree. C. Thus, the resin composition of the present invention is suitable for use in bonding circuit boards and IC members.
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