Flip-chip devices formed on photonic integrated circuit chips
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United States of America Patent
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app pub date -
Aug 2, 2005
filing date -
Jun 19, 2002
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Abandoned
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Abstract
Various embodiments include optically aligning and connecting optical devices to optical grating couplers using a variety of bonding techniques, as a means of transferring optical signals to and from optoelectronic integrated circuits.
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