Pulse plating process for deposition of gold-tin alloy
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United States of America Patent
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Issued Date -
Oct 26, 2006
app pub date -
Jun 21, 2006
filing date -
May 21, 2003
priority date (Note) -
Abandoned
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Abstract
The invention relates to a solution for use in connection with the deposition of a gold-tin alloy on an electroplatable substrate. This solution generally includes water, stannous tin ions, a complexing agent to render the stannous tin ions soluble, and complexed gold ions. Optionally, a deposit conditioning agent can be added to the solution to assist in providing a uniform and bright deposit. The solution has a pH of between about 2 and about 10 and the deposit has a gold content of between about 65% to about 90% by weight and a tin content between about 10% and about 35% by weight. An advantageous way for providing a stable gold-tin deposit is by a pulse plating technique.
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