System for peeling semiconductor chips from tape
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United States of America Patent
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-
Jul 3, 2007
Grant Date -
Oct 26, 2006
app pub date -
Apr 22, 2005
filing date -
Apr 22, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
A system for peeling semiconductor chips from tape is provided with a nose on a housing. The nose has transverse dimensions smaller than the transverse dimensions of a target chip. Apertures are provided through the nose from the housing. Vacuum ports are provided in the housing adjacent the nose. A vacuum source controllably connects to the apertures and the vacuum ports. The nose is positioned adjacent a tape attached on the opposite side thereof to the target chip. Vacuum is applied to attract the tape against the nose and the adjacent portions of the housing to peel the tape from the peripheral edges of the target chip while supporting the tape in the center of the target chip.
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