Die attach adhesives with improved stress performance
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United States of America Patent
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Issued Date -
Oct 19, 2006
app pub date -
Apr 18, 2005
filing date -
Apr 18, 2005
priority date (Note) -
Abandoned
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Abstract
Adhesive compositions containing a base compound or resin and an epoxy resin with vinyl functionality, without a curing agent for the epoxy resin, show enhanced stress performance. The compositions can be used in microelectronic applications.
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