Hot melt adhesives with exceptional wet strength in hot soapy aqueous media
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United States of America Patent
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Issued Date -
Oct 19, 2006
app pub date -
Apr 18, 2005
filing date -
Apr 18, 2005
priority date (Note) -
Abandoned
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Abstract
The invention relates to a hot melt adhesive composition including a blend of a first styrene-isoprene-styrene block copolymer having about 15% by weight styrene and about 42% by weight styrene-isoprene diblock and a second styrene-isoprene-styrene block copolymer having about 30% by weight styrene and substantially 0% by weight styrene-isoprene diblock, a solid plasticizer, a liquid plasticizer, and a tackifying resin. The adhesive composition is resistant to debonding induced by an aqueous soapy medium at about 140.degree. F. and useful for preparing laminates
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