Fabrication method of image scan module
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United States of America Patent
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Issued Date -
Oct 12, 2006
app pub date -
Apr 11, 2005
filing date -
Apr 11, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method of fabricating a CCDM scan module applied for image scan. A circuit board on which electronic devices are mounted is provided. A photo-detector and an integrated circuit device which is either packaged or unpackaged are also mounted on the circuit board to form an image sensor board. The electric connection between the photo-detector, the IC devices and the circuit board is established by wire-bonding technique. A module base is provided, and at least one reflection mirror and one transmission lens are mounted on the module base at predetermined positions. The image sensor board is then mounted on the module base at a position aligned with the lens for focusing an image.
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