Copper base alloy
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United States of America Patent
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Issued Date -
Oct 12, 2006
app pub date -
Apr 1, 2004
filing date -
Apr 10, 2003
priority date (Note) -
Abandoned
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Abstract
This invention has for an object thereof the provision of a leadless copper-based alloy which mends the deterioration of tensile strength at elevated temperatures and enables the mechanical properties thereof to approximate the CAC406 by forming in the alloy texture thereof an alloy or an intermetallic compound with Bi and Pb existing independently or in a mutually joined state. For the purpose of accomplishing the object, this invention incorporates in the copper-based alloy an additive element capable of forming an alloy or an intermetallic compound with Bi and Pb existing independently or in a mutually joined state. The additive element is one or more members selected from the group consisting of Te, P, Zr, Ti, Co, In, Ca, B and misch metal.
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