Method for producing stress impedance effect element and that element

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United States of America Patent

PATENT NO 7318352
APP PUB NO 20060225512A1
SERIAL NO

10507373

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Abstract

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A method for producing a stress impedance effect element, the method including: connecting opposite ends of a magnetostrictive amorphous thin wire and respective electrodes by ultrasonic bonding; forming a groove in an elastic thin substrate having a thermal expansion coefficient equal to that of the magnetostrictive amorphous thin wire; installing the magnetostrictive amorphous thin wire in the groove; and bonding together the magnetostrictive amorphous thin wire and the elastic thin substrate by applying an insulating adhesive across the magnetoresistive amorphous thin wire.

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Patent Owner(s)

Patent OwnerAddress
NAGOYA INDUSTRIAL SCIENCE RESEARCH INSTITUTENAGOYA-SHI AICHI 460-0008

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mohri, Kaneo Nagoya, JP 21 344
Mori, Masaki Nagoya, JP 153 985

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