Photosensitive thick-film dielectric paste composition and method for making an insulating layer using same
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United States of America Patent
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Issued Date -
Oct 5, 2006
app pub date -
Apr 1, 2005
filing date -
Apr 1, 2005
priority date (Note) -
Abandoned
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Abstract
Disclosed is a photosensitive thick-film dielectric paste composition that includes a glass frit having a glass softening point not lower than 0.degree. to 40.degree. C. below a firing temperature ranging above 450.degree. C. and up to 600.degree. C.; an organic polymer binder; a photoinitiator; a photocurable monomer; and an organic solvent, wherein the composition is aqueous-developable upon exposure to actinic radiation. A method for forming an insulating layer using the composition is also provided.
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