Methods and structures to form precisely aligned stacks of 3-dimensional stacks with high resolution vertical interconnect

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United States of America Patent

APP PUB NO 20060223220A1
SERIAL NO

11356717

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Abstract

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Methods and structures to form precisely aligned stacks of 3-dimensional stacks with high resolution vertical interconnections, and associated stacks, structures and devices. Viewing ports are formed in a first nanostructure layer through which an alignment pattern on-a second nanostructure layer is visible when the first and second nanostructure layers are held in near contact before attachment. The second nanostructure layer is then aligned with the first nanostructure layer by viewing the alignment pattern through the viewing ports. Once the layers are aligned, the second nanostructure layer is attached to the first nanostructure layer.

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Patent Owner(s)

Patent OwnerAddress
EPIR TECHNOLOGIES INC590 TERRITORIAL DRIVE UNIT B BOLINGBROOK IL 60440

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bower, Robert W Haiku, HI 24 863

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