Positive photosensitive composition

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United States of America Patent

APP PUB NO 20060222998A1
SERIAL NO

10557798

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Abstract

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There is provided a positive photosensitive composition which requires no burning, makes it possible to obtain necessary and sufficient adhesion when it is applied under a humidity of 25 to 60%, can be developed at a low alkali intensity, makes it possible to carry out development with keeping high sensitivity while forming no residue, ensures sharp edges, can provide a very hard resist film and is improved in scratch resistance in the handling before development. The positive photosensitive composition comprises, as essential components, (A) a high molecular substance having at least one carboxyl group in a molecule and (B) a photo-thermal conversion material that absorbs infrared rays from an image exposure light source to convert them into heat.

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Patent Owner(s)

Patent OwnerAddress
THINK LABORATORY CO LTDKASHIWA-SHI CHIBA 277-8525

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sato, Tsutomu Chiba, JP 269 3149

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