System and method of controlling the demarcation line formed on partially electroplated articles
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United States of America Patent
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N/A
Issued Date -
Oct 5, 2006
app pub date -
Apr 1, 2005
filing date -
Apr 1, 2005
priority date (Note) -
Abandoned
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Abstract
A processing system, electroplating cell, and method of reducing the ration (i.e., demarcation line) that often forms on articles undergoing a partial plating process. The processing system may include a loading station, pre-processing station, electroplating station, post-processing station, unloading station, and a transport system that transports the articles to the various stations. The electroplating cell comprises a container to support a plating fluid bath, an anode electrode, a support structure, which may be part of the transport system, to support the articles such that only a portion thereof is immersed in the plating fluid bath and an air flow system adapted to cause air flow proximate the interface of the articles to the plating fluid bath. The air flow near the articles prevents or reduces plating fluid vapors from impinging the articles, thereby reducing the discoloration that would otherwise form on the articles.
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