Device and applications for passive RF components in leadframes
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United States of America Patent
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N/A
Issued Date -
Sep 28, 2006
app pub date -
Mar 23, 2005
filing date -
Mar 23, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A leadframe and a semiconductor package including such a lead frame, are provided by embodiments of the invention. The leadframe includes a die flag, leads, and a radio frequency (RF) passive component integrally formed into the leadframe. Examples of the RF passive component can be an antenna, such as a spiral or serpentine antenna or one or more transmission lines that can be used as a coupler or filter. The RF passive component can also be tuned to particular frequency values and ranges depending on the particular location of attachment to the RF passive component. The semiconductor package further comprises a semiconductor die and a coupling means with which to connect to the RF passive component to another location on the leadframe, such as the leads and/or the semiconductor die. The semiconductor package may also be encapsulated in a non-conductive material to protect the semiconductor die, coupling means and RF passive component.
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