Method for producing a wire connection
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United States of America Patent
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N/A
Issued Date -
Sep 28, 2006
app pub date -
Mar 20, 2006
filing date -
Mar 23, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method for producing a wire connection between a semiconductor chip and a substrate with which the end of a wire protruding out of a capillary of a Wire Bonder is melted into a wire ball, attached to a first connection point on the semiconductor chip, pulled out to the required length and attached to a second connection point on the substrate is characterized in that, after attaching the wire ball to the first connection point on the semiconductor chip the capillary is first raised by a predetermined distance D.sub.1 and then moved by a predetermined distance D.sub.2 in horizontal or inclined upward direction and in the direction towards the second connection point on the substrate. The distances D.sub.1 and D.sub.2 amount typically to once to twice the diameter of the wire.
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