Method for severing brittle materials by lasers with asymmetric radiation density distribution
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United States of America Patent
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Mar 22, 2006
filing date -
Mar 22, 2005
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Abstract
In accordance with the method of the invention, flat workpieces of brittle material, e.g., sapphire, glass ceramic, or glass, can be severed by inducing thermomechanical stresses, particularly along severing lines of the same direction, with a laser beam having a beam spot with asymmetric radiation density distribution on the workpiece by a relative movement in different directions in that a mirror-symmetric change in radiation density is brought about exclusively by changing the method parameters.
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