Low-dishing composition and method for chemical-mechanical planarization with branched-alkylphenol-substituted benzotriazole
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United States of America Patent
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Issued Date -
Sep 28, 2006
app pub date -
Mar 14, 2006
filing date -
Mar 23, 2005
priority date (Note) -
Abandoned
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Abstract
A composition and associated method for chemical mechanical planarization (or other polishing) are described. The composition comprises a branched-alkylphenol-substituted-benzotriazole. The composition affords low dishing, high metal removal rates, and high selectivities for removal of copper in relation to barrier layer materials and dielectric materials whilst minimizing local erosion effects in CMP. The composition may further comprise an oxidizing agent in which case the composition is particularly useful in conjunction with the associated method for metal CMP applications (e.g., copper CMP). The composition may also further comprise an isothiazoline compound to synergistically impart lower dishing levels during CMP processing.
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