Method for preparing a polishing slurry having high dispersion stability
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United States of America Patent
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Issued Date -
Sep 28, 2006
app pub date -
Mar 24, 2006
filing date -
Mar 28, 2005
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Abandoned
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Abstract
The present invention relates to an improved method for preparing a polishing slurry, comprising dispersing polishing particles and an anionic polymeric acid in water and then adding to the resulting dispersion an alkaline material in an amount of 0.1 to 8 weight parts based on 100 weight parts of the polishing particles. The polishing slurry obtained by the inventive method exhibits good dispersion stability and non-Prestonian polishing performance, which can be beneficially employed in chemical mechanical polishing of various precision electronic devices.
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