Circuit board for surface-mount device to be mounted thereon
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United States of America Patent
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N/A
Issued Date -
Sep 28, 2006
app pub date -
Aug 31, 2005
filing date -
Mar 25, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A circuit board for a surface-mount device to be mounted thereon is provided. The surface-mount device includes a set of first pins and a set of second pins. The circuit board includes a substrate, a set of first conductors, a set of second conductors, and a hole. The hole is formed through the substrate and adjacent to the set of second conductors. The mounting of the surface-mount device is performed by the steps of: (a) disposing the surface-mount device on the substrate; (b) soldering the set of first pins on the set of first conductors and the set of second pins on the set of second conductors by reflowing; (c) checking whether each second pin is electrically-connected with the corresponding second conductor; and (d) re-soldering the second pin that is electrically-disconnected with the corresponding second conductor by a welder through the hole.
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