Stackable printed circuit boards
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Sep 21, 2006
app pub date -
Mar 7, 2005
filing date -
Mar 7, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A system, method and apparatus is provided for stackable printed circuit boards. In one embodiment, the invention is an apparatus. The apparatus includes a FLASH memory module. The memory module includes a printed circuit (p.c.) board. The memory module also includes a first connector attached to the p.c. board. The memory module further includes a second connector attached to the p.c. board. The memory module also includes a FLASH memory coupled to the p.c. board. The FLASH memory is electrically coupled to the first connector. The FLASH memory is electrically isolated from the second connector. In an alternate embodiment, the invention is a method. The method includes receiving a signal for a first p.c. board. Furthermore, the method includes operating the first p.c. board based on the signal for the first p.c. board. Moreover, the method includes receiving a signal at the first p.c. board for a second p.c. board. Additionally, the method includes transferring the signal for the second p.c. board to the second p.c. board. Also, the method includes operating the second p.c. board based on the signal for the second p.c. board.
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