Wafer polishing template for polishing semiconductor wafers in a wax free polishing process
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United States of America Patent
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Issued Date -
Sep 21, 2006
app pub date -
Mar 18, 2005
filing date -
Mar 18, 2005
priority date (Note) -
Abandoned
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Abstract
A template for polishing semiconductor wafers is provided. In the present invention, the edge profile of semiconductor wafers polished in a wax-free process is enhanced by the addition of an edge enhancement ring on the back of the polishing template. The edge enhancement ring may be formed directly as part of the template, or may be an add-on part, such as a double side stick tape or the like. By utilizing an edge enhancement ring, the edge profile of a polished wafer may be significantly improved such that an edge exclusion may be reduced or eliminated, thus providing more usable surface area of the polished wafer.
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