Sputtering target and method for preparation thereof
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United States of America Patent
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Issued Date -
Sep 21, 2006
app pub date -
Mar 22, 2004
filing date -
Apr 3, 2003
priority date (Note) -
Abandoned
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Abstract
A sputtering target prepared by the butt joining of metal sheets being made of the same material, wherein an intermetallic compound in a joined portion has an average particle diameter of 60% to 130% of the average particle diameter of the intermetallic compound in a non-joined portion is provided. In the sputtering target, the average particle diameter of an intermetallic compound in a joined portion is approximately the same as that of the intermetallic compound in a non-joined portion.
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