Method for contacting circuit board conductors of a printed circuit board
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United States of America Patent
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N/A
Issued Date -
Sep 14, 2006
app pub date -
Mar 9, 2006
filing date -
Mar 10, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method for electrically connecting first and second circuit board conductors of a printed circuit board, wherein the first and second circuit board conductors being disposed in different planes of the circuit board and separated by an insulator layer, includes the step of placing a cover onto at least one of the first and second circuit board conductors and making a cutout through the cover, the insulator layer and the first and second circuit board conductors. In addition, an electrically conductive layer is applied under mechanical load onto the cover at least in the area of the cutout so that an electric connection is created along an inner wall surface of the cutout between the first and second circuit board conductors via the electrically conductive layer.
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