Camera module and the manufacturing process thereof
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United States of America Patent
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Issued Date -
Sep 7, 2006
app pub date -
Oct 20, 2005
filing date -
Mar 2, 2005
priority date (Note) -
Abandoned
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Abstract
This invention provides a camera module and a manufacturing process thereof. The camera module is compatible with surface mount technology (SMT) machines for bonding onto a main board. The camera module comprises a lens, a lens holder, and an image sensor device. The lens and the lens holder are connected to each other, and the image sensor device is located under the lens holder. The lens is formed from a heatproof material for enduring the high-temperature process of an SMT soldering machine. The lens holder is also formed from a heatproof material for enduring the high-temperatures process of the SMT soldering machine. The camera module can thus be a surface mount device (SMD) to be bonded by SMT machines onto the main board of a system.
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