Construction of saw devices
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Issued Date -
Sep 7, 2006
app pub date -
Mar 5, 2004
filing date -
Mar 10, 2003
priority date (Note) -
Abandoned
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Abstract
A silicon or quartz wafer for forming a SAW device is the subject of grinding and lapping operation to form its basic shape. The opposing surfaces, as well as the edges extending therebetween, are the polished to reduce the number and size of defects in the surfaces. Metal is deposited onto one of the opposing surfaces which, in use, will be under compression, to form electronic components thereon, and a multi-metallic coating having an outer layer formed of gold is applied to the other surface to form a solder pad by means of which the wafer may be fastened to a shaft or the like by soldering. Martensitic stainless steel is used as a mount, saddle or housing for the SAW substrate.
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