Metal ink, method of preparing the metal ink, substrate for display, and method of manufacturing the substrate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Aug 31, 2006
app pub date -
Feb 24, 2006
filing date -
Feb 28, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A metal ink for ink-jet printing conductive lines, a method of preparing the metal ink, a substrate for a display having a plurality of ink-jet printed conductive lines, and a method of manufacturing the substrate are provided. The metal ink includes dispersed metal nano powders and a solvent, wherein the metal ink includes antiabrasion-promoting nano particles and/or a flexibility-promoting polymer. The dispersed metal nano powders include at least one of silver, gold, platinum, palladium nickel, and/or copper. The metal ink for ink-jet printing conductive lines improves the adhesion, abrasive resistance and flexibility of ink-jet printed conductive lines, such as, ink-jet printed address and bus electrodes, to a ground substrate.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully