Layer cutting apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Aug 24, 2006
app pub date -
Jan 18, 2006
filing date -
Feb 22, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A layer cutting apparatus comprising a tray having an interior defined by a bottom and sidewall. A sleeve is at least partially disposed in the interior of the tray and a cutting line is attached to the sleeve. The cutting line is configured to be removed from the sleeve by pulling the line away from the tray at one point of the sidewall.
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