Optical sensor package and method of manufacture
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Aug 17, 2006
app pub date -
Feb 14, 2005
filing date -
Feb 14, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A semiconductor package for optical sensing and method of manufacture thereof is disclosed. The semiconductor package comprises a substrate for transmitting radiation and an integrated circuit chip for sensing the radiation. A plurality of connectors for electrical transmission is disposed on the substrate and a plurality of pillars for facilitating electrical communication between the plurality of connectors and the integrated circuit chip is disposed between at least one of the plurality of connectors and the integrated circuit chip.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully