System and method for cleaning semiconductor fabrication equipment parts
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United States of America Patent
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app pub date -
Apr 7, 2006
filing date -
Aug 11, 2000
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Abandoned
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Abstract
An exemplary embodiment discloses a process for cleaning semiconductor fabrication equipment parts with non-metallic surfaces. The process optionally includes providing a semiconductor fabrication part with a non-metallic surface to be cleaned and applying a dilute aqueous solution to remove contamination from the non-metallic surface. The aqueous solution optionally includes dilute amounts of hydrofluoric acid, nitric acid and hydrogen peroxide. The dilute amounts would optionally be in the ranges of 0.5-1.5% wt. hydrofluoric acid, 0.1-0.5%wt. nitric acid and 1-10%wt. hydrogen peroxide.
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