Curable resin compositions
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United States of America Patent
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Issued Date -
Aug 10, 2006
app pub date -
Feb 8, 2005
filing date -
Feb 8, 2005
priority date (Note) -
Abandoned
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Abstract
This invention relates to a curable resin composition which shows excellent chemical resistance, dielectric characteristics, heat resistance, flame retardancy and mechanical properties and low water absorption and is suitable for dielectric materials, insulating materials, heat-resistant materials, structural materials and the like. This curable resin composition comprises component (A) or polyphenylene ether resin and component (B) or a solvent-soluble polyfunctional vinyl aromatic copolymer having constitutional units derived from monomers composed of divinyl aromatic compound (a) and monovinyl aromatic compound (b) or, more particularly, having 20 mol % or more of a repeating unit derived from divinyl aromatic compound (a) and constitutional units represented by the following formulas (2) and (3) wherein R.sup.5 represents an aromatic hydrocarbon group containing 6-30 carbon atoms, Y represents an aliphatic hydrocarbon group, an aromatic hydrocarbon group or an unsubstituted or substituted aromatic ring condensed with the benzene ring of the indane ring and n is an integer of 0-4.
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