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Abstract

A novel wire-based interconnect IC package is described as well as the method of designing and the method of producing the IC package. The IC package includes one or more signal carrying wires as well as ground return wires associated with each signal carrying wire to electrically couple a chip to a carrier substrate. Both the signal carrying wire and its associated ground return wires may be insulated, however at least the signal carrying wire or the ground wires are insulated. The inductance of the signal carrying wires can be kept low by keeping the wirebonds as short as possible and by positioning a number of ground wires symmetrically about and in close proximity to the signal carrying wire. The signal carrying wires and the ground return wires are connected to bond pads on the chip and to bond fingers on the carrier substrate to couple the chip to the substrate. Further, the bond pads may be staggered such that the effective pitch of the bond pads is less than the diameter of the wire, and the bond fingers may be positioned on a bond finger ring and to bonding locations outside the ring providing an effective pitch of the bond fingers of less than the diameter of the wire.

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First Claim