Polishing tool and polishing apparatus
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United States of America Patent
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N/A
Issued Date -
Aug 3, 2006
app pub date -
Mar 12, 2004
filing date -
Mar 14, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A polishing tool is used for polishing a workpiece (13) such as a semiconductor wafer to a flat mirror finish. The polishing tool has a polishing table (10) and a polishing pad (11) attached to an upper surface of the polishing table (10). The polishing pad (11) has a plurality of polishing pad pieces (111) attached to the polishing table (10). It is possible to facilitate adjustment of polishing performance over a surface of the workpiece (13) and replacement of a polishing pad (10).
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