Electronic device manufacture
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United States of America Patent
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N/A
Issued Date -
Jul 27, 2006
app pub date -
Mar 23, 2006
filing date -
Apr 5, 2003
priority date (Note) -
Abandoned
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Abstract
Compositions suitable for use as underfill materials in an integrated circuit assembly are provided. Also provided are methods of preparing integrated circuit assemblies containing certain underfill materials as well as electronic devices containing such integrated circuit assemblies.
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