Slurry for polishing copper film and method for polishing copper film using the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Aug 11, 2005
app pub date -
Feb 4, 2005
filing date -
Feb 5, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Disclosed are a slurry for polishing a copper film and a method for polishing a copper film using the slurry. A slurry containing H2O2 as an oxidizer and glycine as an inhibitor is prepared. Polishing of a copper film is performed in such a manner that the slurry is provided onto a polishing pad, and a copper film is contacted with the polishing pad. In the copper film polishing, no contamination occurs and surface roughness of the copper film is favorable.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully