Pulse plating process for deposition of gold-tin alloy
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jul 27, 2006
app pub date -
Jan 19, 2006
filing date -
Jan 21, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The invention relates to a solution for use in connection with the deposition of a gold-tin alloy on an electroplatable substrate. This solution generally includes water, stannous tin ions, a complexing agent to render the stannous tin ions soluble, complexed gold ions, and an alloy stabilization agent that includes an imine functional group. The alloy stabilization agent is present in an amount sufficient to stabilize the composition of the gold-tin deposit over a usable current density range. The solution has a pH of between about 2 and about 10 and the deposit having a gold content less than about 90% by weight and a tin content greater than about 10% by weight. An advantageous way for providing the desired deposit is by a pulse plating technique.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully