Sputtering cathode, production method and corresponding cathode
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United States of America Patent
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Issued Date -
Jul 27, 2006
app pub date -
Aug 27, 2003
filing date -
Sep 3, 2002
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Abandoned
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Abstract
Sputtering cathode and method has a basic cathode body with cooling arrangement, and a cooling contact body disposed between the cooling arrangement and a target such that it is heat conducting, and wherein the contact face between the cooling contact body and the target is provided with a friction-reducing layer.
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