IC token, injection molding die for the IC token manufacturing method for the IC token and an IC token selection device
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United States of America Patent
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Issued Date -
Jul 20, 2006
app pub date -
Dec 27, 2005
filing date -
Dec 28, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An IC token for use in a machine such as a gaming device has an IC tag centrally located within a ring of electromagnet wave-absorbing material. The ring is designed to permit a peripheral attachment to the edges of the IC tag with appropriate molding dies to encapsulate the IC token in a resin. The IC token is adapted to be read by a selection device having an antenna along an inclined guide rail while eliminating the possibility of crosstalk between tokens.
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