LED PACKAGING METHOD AND PACKAGE STRUCTURE
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United States of America Patent
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Issued Date -
Jul 20, 2006
app pub date -
Jun 10, 2005
filing date -
Jan 19, 2005
priority date (Note) -
Abandoned
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Abstract
A LED packaging method is disclosed. The LED packaging method includes the steps of forming a high reflectivity alloy layer on an electrode layer of a support; coating a polymer adhesive on a portion of the upper surface of the high reflectivity alloy layer to form an adhering point; and fixing a chip on the adhering point and baking the chip, wherein the polymer adhesive includes an epoxy resin and at least one of acid anhydride and amine.
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